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  • Professional PCB and FPC Separator-Printed Circuit Board Processing with UV Lasers,CWVC-5L
Professional PCB and FPC Separator-Printed Circuit Board Processing with UV Lasers,CWVC-5L

Professional PCB and FPC Separator-Printed Circuit Board Processing with UV Lasers,CWVC-5L

  • Product description: Professional PCB and FPC Separator-Printed Circuit Board Processing with UV Lasers,CWVC-5L
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Professional PCB and FPC Separator-Printed Circuit Board Processing with UV Lasers,CWVC-5L 

Specification

Laser

Q-Switched diode-pumped all solid-state UV laser

Laser Wavelength

355nm

Laser Power

10W/12W/15W/17W@30KHz

Positioning Precision of Worktable of Linear Motor

±2μm

Repetition Precision of Worktable of Linear Motor

±1μm

Effective Working Field

460mmX460mm(Customizable)

Laser Scanning Speed

2500mm/s (max)

Galvanometer Working Field Per One Process

40mmх40mm

Features:


  • Pre-camera vision product position registration and model check
  • Coherent Avia NX UV laser with HurrySCAN head
  • High capacity BOFA dust collector
  • User friendly Window based software
  • PCB flexible product jig adjustable for different board size
  • High resolution and accurate Z stage with auto-focus function
  • Large area low friction front loading platform for sliding multiple product jigs
  • Fully covered class 1 safety enclosure
  • Able to do cutting and marking together
  • Compact size
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

· Damages and fractures to substrates and circuits due to mechanical stress

· Damages to PCB due to accumulated debris

· Constant need for new bits, custom dies, and blades

· Lack of versatility – each new application requires ordering of custom tools, blades, and dies

· Not good for high precision, multi-dimensional or complicated cuts

· Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

Professional PCB and FPC Separator-Printed Circuit Board Processing with UV Lasers,CWVC-5L CE Certification: