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SMT Inspection AOI

  • AOI SMT Automated Optical Inspection Systems AOI,CW-A586
AOI SMT Automated Optical Inspection Systems AOI,CW-A586

AOI SMT Automated Optical Inspection Systems AOI,CW-A586

  • Product description: AOI SMT Automated Optical Inspection Systems AOI,CW-A586
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SMT Automated Optical Inspection Systems AOI,CW-Z588 Feature:

The new structure design is accord with human body engineering.

The software supports the database control, can emote programming and the debugging, and carries on the data collection and the analysis.

The software support for offline programming and off-line debugging.

Single box multi algorithm combination, the programming interface more concise and clear.

The AOI machine can interact directly with NG BUFFER and other machines through the specific communication protocol.


Easy to operate and multi-function AOI

It can be placed at several quality controlling points in SMT line to check 2D paste printing quality,inspect component defects before reflow soldering, inspect PCBA quality after reflip soldering and DIP wave soldering.



SMT Automated Optical Inspection Systems  AOI,CW-Z588 Specification:

Category

Item

CW-Z588

CW-Z588L

Recognition System

Inspection

Using multiple algorithm synthetically such as WIDM, Color Image contrast technology, Color extracting technology, similarity, two-value handling technology, OCR/OCV, Solder ball inspection, PTH analysis  and so on.

Camera

Distal and high speed color CCD camera: 20 um

15um12um10um for option

Lamp-house

4 Rings RGBB LED lamp-housewith special coaxial optical for option.

FOV

40.96mm×40.96mm (20um)30.7mm*30.7mm (15um)

Image Processing Speed

0201 Chip

7.6ms

Per-image Time

220ms(20um)

Inspection Item

Paste Printing Defects

Misaligned, overflow, insufficient, pasting open, stain

Components Defects

Missing, shift, skewed, tombstone,billboard, overturned,reversed polarity, wrong, damage

Solder Defects

Overflow, insufficient, short solder, stain

Wave Solder Inspect

Overflow, insufficient, short solder, excess solder, solder void

Mechanism System

PCB conveyor

Left to right(Optional, right to left)PCB fixing: bottom-up, PCB warp correction.Automatic PCB loading and unloading, Adjustable clearance, Conforming SMEMA standard.Orbit clearance: 900±20mm

PCB sizes

50×50mm-400×330mm 50×50mm-510×460mmcan make bigger size according to clients demands

PCB Thickness

0.3mm 3.0mm

PCB Warp tolerance

2mm

Component clearance

TOP50mm,BOP75mm

X,Y platform & Z axis

Driver

AC server, camera moves in the directions of X/Y

Orientation

10um

Moving Speed

500mm/s

Operation System

Microsoft Windows 7*64

Controlling & Recognizing

Characteristics

Set template images real time, count data and error gate value automatically. Three marks correction, ,input CAD date locate the templates automatically,the operator can combine algorithms according to the requirement.

Operation

Graphic programming, Chinese, English

Offline Programming

Offline programming and Offline debugging

Controller

Computer

CPU:Intel dual-core, Memory:16G, Hard disk:1TB

Display

19 inch TFT

22 inch TFT

Multi Machine Control

The operator can control multi same machines in the control terminal

Others

Machine Dimensions(L*W*H)

96cm×100cm×158cm

104cm×110cm×158cm

Weight

710KG

850KG

Power Supply

AC220V, 10%, single phase 5A 50/60HZ, power consumption 1000W with UPS inside

Working Environment

Temperature10-40, humidity 30-80% RH


SMT Automated Optical Inspection Systems | AOI,CW-Z588 Introduction:

New light source design

The Z588 adopts multi angle Light source design , through different angles of illumination to sampling the details of the characteristics of the object to be detected, accurately obtain the assembly and welding information posted element,detected the NG accurately.

Solder ball inspection function

Through the surface color, brightness,solder ball shape and color feature to inspect if there is any solder ball on the PCB. The machine can inspect the solder ball surround the component,

also can inspect the whole PCB through the inspection frame.

BGA inspection function

This function used before mounting toinspect if there are insufficient solder,missing ball, solder bridge and so on.

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